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TEST AND MEASUREMENT PRODUCTS Description
Low Cost, Dual-Channel, 15V Pin Electronics Driver/Window Comparator
Features
* * * * * * * * * 5V I/O Range 200 mA DC Current Capability Low Output Impedance 50 MHz Operation Driver Short Circuit Protection Per-Pin Flexibility Programmable Input Thresholds LVTTL Compatible I/O Small footprint (5 mm x 5 mm QFN with Exposed Heat Slug) * Improved Small Signal Swing and Timing Performance * Low Preshoot/Overshoot/Undershoot * Pin Compatible with E7801 and E7803
E7802
The E7802 is a dual-channel pin electronics driver and window comparator product fabricated in a wide voltage Bi-CMOS process. It is designed specifically for Test During Burn In (TDBI) applications and low cost testers, where cost, functional density, and power are all at a premium. The E7802 incorporates two channels of programmable drivers and window comparators into a small 5 mm X 5 mm QFN package. Each channel has per pin driver levels, data, and high impedance control, along with per-pin high and low window comparator threshold levels. The E7802 was specifically designed to offer a low cost, high density driver and window comparator solution with excellent small swing performance and stable timing characteristics. A 5V driver output and receiver input range allow the E7802 to interface directly with TTL, ECL, CMOS (3V, 5V, and 7V), LVCMOS, and custom level circuitry, as well as high voltage levels required for many special test modes in Flash Devices and for stressing devices under test.
Functional Block Diagram
VH[0] VL[0]
Channel 0 DATA[0] EN[0] DOUT[0]
Applications
* Burn In ATE * Low Cost ATE * Instrumentation
QH[0]
CVH[0]
VINP[0] QL[0] CVL[0]
VDD CVL[1] VINP[1] QH[1] CVH[1]
QL[1]
EN[1] DATA[1] Channel 1
DOUT[1]
VH[1] VL[1]
Revision 5 /March 7, 2008
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E7802
TEST AND MEASUREMENT PRODUCTS PIN Description
Customer Pin Descriptions
Pin Name DATA[0:1] Pin Number 30, 11 Description Digital inputs which determine the high/low output state of the driver, when it is enabled. Digital input which enables/disables the driver. Comparator digital outputs. Driver Outputs. Comparator Inputs. Unbuffered analog inputs that set the driver high voltage level. Unbuffered analog inputs that set the driver low voltage level. Analog inputs that set the threshold for the high comparator. Analog inputs that set the threshold for the low comparator. Digital supply. Ground pad. Connect to 0V. Positive power supply. Negative power supply. Driver negative supply. Short circuit protection enable pin (has 5.3Kohms internal pull-down to GND). Connect to VDD if short circuit protection is not required in the application. Open drain short circuit flag that pulls-down to indicate that a channel of the E7802 is in short circuit protection mode. Connected to anode of temperature sensing diodes.
EN[0:1] QH[0:1] QL[0:1] DOUT[0:1] VINP[0:1] VH[0:1] VL[0:1]) CVH[0:1] CVL[0:1] VDD GND VCC[0:1] VEE DVEE[0:1] SCP*
29, 12 32, 9 31, 10 22, 19 24, 17 23, 18 21, 20 27, 14 25, 16 2, 3 7 28, 13 4, 5, Center Pad 26, 15 1
INT* TEMP
6 8
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08
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E7802
TEST AND MEASUREMENT PRODUCTS PIN Description (continued)
Pinout
DVEE[0] 26
DATA[0]
VCC[0]
CVH[0]
32
31
30
29
28
27
SCP* VDD VDD VEE VEE INT* GND TEMP
1 2 3 4 5 6 7 8
25
CVL[0]
QH[0]
EN[0]
QL[0]
24 23
VINP[1] VH[0] DOUT[0] VL[0] VL[1] DOUT[1] VH[1] VINP[1]
32-Pad 5mm X 5mm MLP with Exposed Thermal Pad (Connect to VEE)
22 21 20 19 18 17
10
12
13
14
15 DVEE[1]
QH[1]
QL[1]
DATA[1]
EN[1]
VCC[1]
CVH[1]
CVL[1]
16
11
9
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08
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E7802
TEST AND MEASUREMENT PRODUCTS Circuit Description
Description The E7802 supports independently programmable driver high and low levels as well as tristate per channel. There are no shared lines between the two drivers. The EN and DATA signals are inputs that are used to control the output of the driver as shown in Table . Each channel of the E7802 features a window comparator with separate high and low threshold levels (CVH, CVL), as well as independent digital outputs (QH, QL). Driver Output Protection The E7802's drivers feature short circuit protection circuitry that prevents them from being damaged in the event of a short circuit at their outputs. In the event of a short circuit at the driver output and short circuit protection is enabled (SCP*=0), DOUT will place itself in a high impedance state and the comparator outputs, QH and QL, are designed to both assert a Logic "0" to indicate that a short circuit event has occurred. In addition to the comparator outputs pulling down, the INT* pin will become active (pull-down) when either channel detects a s hort-circuit condition. Multiple E7802 INT* pins may be wire-or'd together with a single VDD pull-up load to create a system-wide notification signal that a short circuit has occurred on one of the chanels in the system. After a short circuit event has occurred, the driver can be reset to the active state by toggling the EN pin from Logic "0" to Logic "1" . Either after power-up or after short circuit protection is enabled, the EN pin needs to be toggled from Logic "0" to Logic "1" to allow the driver to power up in the active state and ensure the short circuit protection is reset for proper operation (see Timing Diagram below).
short circuit occurs Tri-state
EN 0 0 1 1
DATA 0 1 0 1
DOUT HiZ HiZ VL VH
Table 1. Driver Functionality
NOTE: The voltage at DOUT needs to stay at DVEE < DOUT < VCC at all times (HiZ/Active). Drive High and Low VH and VL define the logical "1" and "0" levels of the driver, and can be adjusted to produce driver output swings from 200mV up to 5V. The VH and VL inputs are unbuffered. They provide the driver output current (see Figure 1), so the source of VH and VL must have ample current drive capability. (See Applications Note PE-A1).
VH
DOUT
Q H
Valid Comp. Output
Q L
Valid Comp. Output
INT*
E N
Driver Logic
DATA
TINT*
DOUT
To e
EN
VL
Because of the nature of the SCP circuit design, it is recommended that the user have SCP enabled only under the valid SCP operating zone. Refer to Figure 2 for the conditions.
Figure 1.
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08
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E7802
TEST AND MEASUREMENT PRODUCTS Circuit Description (continued)
Short Circuit Protection Operating Zone
16 14 12 10 8 6 4 2 0 0 5 10 15 20 25 Freq (MHz) 30 35 40 45 50
6.
Disable short circuit protection (SCP*=1) and start running the driver at the desired operating conditions.
VH [V] (VL=0V)
Tj=100C Tj=65C Tj=40C Tj=25C
NOTE: If short circuit protection is used outside of the valid SCP operating zone, false SCP triggers can occur which will disable the driver output, DOUT. Window Comparator
CVH
Valid SCP Operating Zone
+
QH
Figure 2.
For applications that require operation outside the valid SCP operating zone, the user can use the SCP to check for any short circuit occurrence down the line and protect the driver from over-current damage before running it at the desired operating conditions. Refer to the following procedure: 1. 2. While the driver is in HiZ (EN=0), enable short-circuit protection (SCP*=0) Set VH to the maximum programmable voltage in the system, switch DATA to Logic "1" and toggle the EN pin from Logic "0" to "Logic "1". After the driver is enabled, wait approximately 2 s and monitor all INT* pins in the system to determine if there is any short circuit occurrence. If the INT* signal remains high, no short circuit condition is detected. If the INT* signal becomes low (active), this indicates a short circuit condition has occurred in one or more channels in the system. Determine the shorted channel(s) by checking the comparator outputs (QH=0, QL=0). Remove the fault condition in each channel respectively and reset those driver(s) Repeat Steps 3 through 4 with minimum programmable VL in the system and switch DATA to Logic "0".
VINP
+
QL CVL
3.
Each channel of the E7802 features two comparators connected in a window comparator configuration. CVH and CVL are high impedance analog voltage inputs that establish the upper and lower thresholds for the window comparator. CVH should always be greater than or equal to CVL for normal comparator operation. QH and QL are digital outputs that indicate where a voltage measurement lies in relation to the CVH and CVL thresholds and are also used to indicate when short circuit protection is engaged as shown in Table 2.
Condition Measurement is within the range established by CVH and CVL Measurement is above the range established by CVH and CVL Measurement is below the range established by CVH and CVL Short circuit protection is engaged and Driver is disabled QH 1 0 1 0 QL 1 1 0 0 INT* 1 1 1 0
4.
5.
Table 2. Comparator Output Truth Table
The receiver thresholds can be used over a range of VEE +3V to VCC -3V. The VINP input of the receiver is designed to withstand voltages from VEE+2V to VCC such that the comparator input can be directly connected to the driver output without being damaged.
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E7802
TEST AND MEASUREMENT PRODUCTS Circuit Description (continued)
NOTE: DVEE MUST be set appropriately in order to accommodate VINP input voltages of VEE + 2V when DOUT and VINP are connected in an application. Thermal Diode String The E7802 features an internal diode string connected between EN[1] and TEMP that can be used to perform device junction temperature measurements as shown in the figure below. NOTE: EN[1] must be asserted "low" when making temperature measurements.
EN[1]
100 A External Current Source
Temperature Coefficient= -5.9mV/C
TEMP
(0.7195 - TEMP - EN[1] 3 0.001967 )
Tj[C] =
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08
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E7802
TEST AND MEASUREMENT PRODUCTS Application Information
Power Supply Decoupling VCC, VEE, and DVEE should be decoupled to GND with a .1 F chip capacitor in parallel with a .00 F chip capacitor for best AC performance. A VCC, VEE, and DVEE plane, or at least a solid power bus, is recommended for optimal performance. VH and VL Inputs As the VH and VL inputs are unbuffered to the driver and need to supply the output current which can be quite large during edge transitions, bypass capacitors for these inputs are needed to supply the transient currents in proportion to the output current requirements (See Applications Note PE-A1). For applications where VH and VL are shared over multiple channels, a solid power plane to distribute these levels with local bypassing is recommended for best AC performance . Power Supply Sequencing/Latch-Up Protection In order to avoid the possibility of latch-up when powering this device up (or down), be careful that the conditions listed in the Absolute Maximum Ratings are never violated. The power supplies should never be in reverse-polarity with respect to ground, and the input signals should never go beyond the power supply rails. Furthermore, the lower-voltage supplies should never be greater than the higher-voltage supplies. This can easily be implemented by utilizing the diode circuit depicted in Figure 3 for each PCB utilizing the E7802. The following conditions must be met at all times during power-up and power-down: 1. VEE <= DVEE <= VDD <= VCC 2. VEE <= Analog Inputs <= VCC 3. GND <= Digital Inputs <= VDD The following sequencing can be used as a guideline when powering up: 1. VEE(substrate) 2. VCC 3. VDD 4. Digital Iputs 5. Analog Inputs
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08
The three diode configuration shown in Figure 3 should be used on a once-per-boad basis to help ensure that proper supply polarities are maintained.
VCC
VDD 1N5820 or Equivalent Schottky Diodes
GND
VEE
Figure 3. Power Supply Protection Scheme Warning: It is extremely important that the voltage on any device pin does not exceed the range of VEE -0.5V or VCC +0.5V at any time, either during power up, normal operation, or during power down. Failure to adhere to this requirement could result in latch-up of the device which could be destructive if the system's power supplies are capable of supplying large amounts of current. Even if the device is not immediately destroyed, the cumulative damage caused by the stress of repeated latchup may affect device reliability.
Computing Maximum Power Comsumption The power consumption of the E7802 increases with increasing frequency and output voltage swing. The diagram below shows the power consumption of the E7802 at a couple of different voltage swings across the frequency range with both channels toggling.
E7802 Power Dissipation vs. Frequency (Open Transmission Line)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 10
Power per Ch.(W)
VCC=15V, VEE=-5V, DVEE=0V, VDD=3.3V, 3V Swing
VCC=5.4V, VEE=-5V, DVEE=-3.6V, VDD=3.3V, 3V Swing
20
30
40
50
Toggle Freq (MHz)
7
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E7802
TEST AND MEASUREMENT PRODUCTS Application Information (continued)
Cooling Considerations Depending on the maximum operating frequencies and voltage swings the E7802 will need to drive, it may require the use of an external heatsink to keep the maximum die junction temperature within a safe range and below the specified maximum of 100C. The E7802 package has an external heat slug located on the bottom side of the package to efficiently conduct heat away from the die to the package surface. The thermal resistance of the package to the slug is the jc (junctionto-case) and is specified at <1C/W. Additional cooling capability can be attained through the use of a heat sink on the top of the package. The plastic on the top of the E7802's package is extremely thin and has an effective thermal impedance of <4C/W. In order to calculate what type of heatsinking should be applied to the E7802, the designer needs to determine the worst case power dissipation of the device in the application. The graph above gives a good visual relationship of the power dissipation to the maximum operating frequency (all channels simultaneously) and driver output voltage swings. Another variable that needs to be determined is the maximum ambient air temperature that will be surrounding or blowing on the device and/or the heatsink system in the application (assuming an air cooled system). A heatsinking solution should be chosen to be at or below a certain thermal impedance known as the R in units of degC/Watt. The heatsinking system is a combination of factors including the actual heatsink chosen and the selection of the interface material between the E7802 package and the heatsink itself. This could be thermal grease or thermal epoxy, each of which has its own thermal impedance. The heatsinking solution will also depend on the volume of air passing over the heatsink and at what angle the air is impacting the heatsink. There are many options available in selecting a heatsinking system. The formula below shows how to calculate the required maximum thermal impedance for the entire heatsink system. Once this is known, the designer can evaluate the options that best fit the system design and meet the required R. R(heatsink system) = (Tjmax - Tambient - P*jc)/P where: R (heatsink_system) is the thermal resistance of the entire heatsink system Tjmax is the maximum die temperature (100C) Tambient is the maximum ambient air temperature expected at the heatsink (C) P is the maximum expected power dissipation of the E7802 (Watts) jc is the thermal impedance of the E7802 junction to case (<1C/W though bottom, <4C/W through top) The value of the thermal resistance of the E7802 package junction to air with 400 linear feet per minute (LFPM) of airflow is specified at 28C/W. At operating points greater than or equal to this value, no additional heatsinking is needed to keep the die temperature below the maximum 100C as long as the ambient temperature of the 400 LFPM air does not exceed 70C. More information on heatsink system selections can be read on heatsink vendors' web sites and in the Semtech Application Note "ATE-A2 Cooling High Power, High Density Pin Electronics. Driving a Resistive Load In addition to the VCC and VEE power supply levels, the "driver high" (VH) and "driver low" (VL) levels used in an application also have an effect on the total power dissipation of the device illustrated using Figure .
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E7802
TEST AND MEASUREMENT PRODUCTS Application Information (continued)
External "Driver High" Buffer
Therefore, the per-channel power dissipation due to the E7802 driving resistive load is: P = [IL (H) x Rds(H) x D] + [IL (L)] x Rds(L) x (1-D)] where: P is the total power dissipated by E7802 as a result of the resistive load, RL [] IL(H) is the amount of current required by RL during a logic "high" state [A] Rds(H) is the output impedance of the E7802 driver when driving a logic "high" state [] D is the normalized amount of time that logic "high" is driven (Duty Cycle) IL(L) is the amount of current required by RL during a logic "low" state [A] Rds(L) is the output impedance of the E7802 driver when driving a logic "low" state [] Driving Currents Larger than 200mA The driver channels of the E7802 can be connected in parallel to drive currents larger than the rated 200mA per individual driver.
2 2
V H
Rds(H) Simplified E7802 Output Stage
H L
DOUT
IL
RT
Rds(L)
VT
V L
External "Driver Low" Buffer
Figure 4. Simplified Functional Schematic of E7802 Output Stage and External Buffers
The CMOS switches of the E7802's output stage have onresistance values (depicted by Rds(H) and Rds(L) in Figure 4) that vary as a function of VH and VL voltage levels. The amount of current required by the load impedance, RT, is also a function of the VH and VL voltage levels as follows: Switch in Figure 3 is in position "H": IL(H) = VH - V T Rds(H) + RT VL - V T Rds(L) + RT
Switch in Figure3 is in position "L": IL(L) =
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E7802
TEST AND MEASUREMENT PRODUCTS Application Information (continued)
Optimizing Driver Waveforms
Overshoot/Undershoot/Preshoot
E7802 Driver overshoot, undershoot and preshoot are functions of the DOUT edge rate. Slower DOUT edge rates are associated with smaller overshoot, undershoot and preshoot amplitudes. The DOUT edge rate is influenced by the amount of capacitance that is present on the driver output with larger capacitance resulting in slower edge rates and less overshoot as shown below.
Driver Output Waveform vs. Capacitive Load
3.0
matching for a 50 transmission line. See Applications Note PE-A2, "Optimizing the Output ConfigurationofSemtechBipolarPinDrivers" for more details on selecting the proper "back-match" resistor.
2) ReactiveComponent: Accounts for the reactive or "AC" component of the output impedance and is matched to a transmission line by using external inductors and/or capacitors. Using empirical methods in our lab, we have determined that an 8nH series inductor offers the best impedance matching for a 50 transmission line (see below).
2.5
C = 0pf
2.0
Output Voltage [V]
C = 33pF
1.5
Driver Output Impedance Optimization (Reactive Component)
3.5
1.0
3.0 2.5
0.5
Output Voltage [V]
0.0
2.0 1.5 1.0 0.5 0.0 -0.5 10 20 30 40 50 60 70 80
-0.5 0 10 20 30 40 50 60 70
Time [nS]
Overshoot, undershoot and preshoot are also influenced by power supply levels. In general, lower VCC levels are associated with less overshoot and better small-swing performance.
Output Impedance Matching
Time [ns]
How well the driver output impedance matches a transmission line connected to it has a direct effect on waveform characteristics. Driver output impedance can be separated into two components: 1) Real Component: Accounts for the resistive (DC) portion of the driver output impedance and is matched to a transmission line by using an external "back-match" resistor. Using empirical methods in our lab, we have determined that a 45.3 backmatch resistor offers the best real impedance
L = 18nH
External component connections are illustrated in the E7802 Hookup Diagram.
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90
0
E7802
TEST AND MEASUREMENT PRODUCTS Application Information (continued)
E7802 Hookup Diagram
VCC
DVEE (Note 2)
1
VDD
SCP* VDD VDD VEE VEE INT* GND TEMP
VINP[0] VH[0] DOUT[0] VL[0] VL[1] DOUT[1] VH[1] VINP[1]
24 23 22 21 20 19 18 17
VH
50 18nH
D U T
2 3
**
45.3
VEE
4 5
** **
45.3
VL VL
VDD
Rpu
Note 3
6 7 8
VH
18nH 50 D U T
**
VCC
DVEE
All capacitors are 0.F unless otherwise noted. ** See Applications Note PE-A1 for proper capacitor and VH/VL supply selection. Note 2: DVEE supply can be connected to GND if DOUT does not need to swing below 0V. Note 3: Choose Rpu such that the INT* current is less than 5mA.
Note :
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E7802
TEST AND MEASUREMENT PRODUCTS Package Information
32-Pad 5mm x 5mm QFN Package Outline
A
D
B
DIM MIN
DIMENSIONS INCHES .031 .039 .000 .002 - (.008) .007 .010 .012 .193 .197 .201 .130 .136 .140 .193 .197 .201 .130 .136 .140 .020 BSC .012 .016 .020 32 .003 .004
NOM MAX
MILLIMETERS
MIN
PIN 1 INDICATOR (LASER MARK)
E
A2 A aaa C A1 D1 C LxN SEATING PLANE
A A1 A2 b D D1 E E1 e L N aaa bbb
1.00 0.80 0.00 0.05 - (0.20) 0.25 0.30 0.18 4.90 5.00 5.10 3.30 3.45 3.55 4.90 5.00 5.10 3.30 3.45 3.55 0.50 BSC 0.30 0.40 0.50 32 0.08 0.10
NOM
MAX
E/2 E1 2 1 N bxN e NOTES: 1. 2. D/2 bbb C A B
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
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E7802
TEST AND MEASUREMENT PRODUCTS Package Information (continued)
32-Pad 5mm x 5mm QFN Land Pattern
K DIM Z (C) H G C G H K P X Y Z
DIMENSIONS INCHES (.197) .165 .146 .146 .020 .012 .031 .228 MILLIMETERS (5.00) 4.20 3.70 3.70 0.50 0.30 0.80 5.80
Y X P
NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. 4. SQUARE PACKAGE - DIMENSIONS APPLY IN BOTH " X " AND " Y " DIRECTIONS.
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E7802
TEST AND MEASUREMENT PRODUCTS Absolute Maximum Ratings
Parameter Positive Analog Supply Negative Analog Supply Negative Driver Supply Digital Power Supply Digital Input Voltages Driver Pins Comparator Pins Storage Temperature Junction Temperature IR Reflow Conditions Symbol VCC VEE DVEE VDD EN[0:1], DATA[0:1], SCP* VH[0:1], VL[0:1], DOUT[0:1] CVH[0:1], CVL[0:1], VINP[0:1] TS Tj Tpkg Min -0.5 -6 VEE -0.5 -0.5 DVEE + 0.5 VEE - 0.5 -65 Max DVEE + 16 +0.5 +0.5 +6.0 VDD + 0.5 VCC + 0.5 VCC + 0.5 +150 +150 +260 Units V V V V V V V C C C
Recommended Operating Conditions
Parameter Positive Analog Supply Negative Analog Supply Negative Driver Supply Digital Power Supply Thermal Resistance - Junction to Case Junction to Top-Center of Case Junction to Bottom-Center of Heat Slug Thermal Resistance - Junction to Ambient Still Air Junction Temperature Symbol VCC VEE DVEE VDD jc 4 1 ja
TJ 25
Min DVEE + 9 -5.25 -3.6 3.0
Typ -5
Max -4.75 0 3.6
Units V V V V C/W C/W C/W
DVEE + 14.5 DVEE + 15
26
100
C
Stresses above those listed in "Absolute Maximum Ratings" section may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these, or any other conditions beyond those listed, is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.
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E7802
TEST AND MEASUREMENT PRODUCTS DC Characteristics
Parameter Driver Driver "High Level" Range Driver "Low Level" Range 10.4 V < VCC 15V 5.4V VCC 10.4V Driver Output Swing Driver Output Impedance VCC = 15V, Tj = 65 3 C C Across Recommended Operating Conditions Offset Voltage Driver Digital Input Logic Levels (DATA, EN, SCP*) Logic Input "High" Level Logic Input "Low" Level Driver Digital Input Current DATA, EN SCP* Hi-Z Leakage Current at DOUT (DVEE DOUT VCC) DC Output Current (Note 1) AC Output Current (Note 2) Short Circuit Protection Threshold VL DOUT VH DVEE DOUT VCC INT* Output Low Voltage @ IINT*=5mA Comparator Analog Inputs CVH Input Voltage Range (Note 3) CVL Input Voltage Range (Note 3) CVH, CVL Input Current VINP Voltage Range VINP Input Current DVEE VINP VCC - 3V Across Full VINP Range Hysteresis Offset Voltage Digital Outputs Output "High" Voltage @ +5 mA Output "Low" Voltage @ -5 mA VHYS VOS VOH VOL VCVH VCVL IIN VVINP IVINP -30 -200 30 -50 2.4 0.4 +50 +30 +200 A A mV mV V V VCVL VEE + 3 -15 VEE + 2 VCC - 3 VCVH +15 VCC V V A V VOL VH VL DVEE DVEE DOUT Rout 4 2.5 |VH, VL - DOUT| VIH VIL IIH, IIL IIH, IIL ILEAK IOUT(DC) IOUT(AC) 2.0 0.8 -200 -1 -35 -200 1.4 205 75 +200 0 +75 +200 3.6 300 350 0.4 0.5 8.5 11 2.5 mV V V nA mA nA mA A mA mA V 0.2 VCC - 8.4 2 15 V V V VL VCC V Symbol Min Typ Max Units
Test conditions (unless otherwise specified): "Recommended Operating Conditions". Note 1: DC output current is specified per individual driver, VVL < VDOUT < VVH. Note 2: Surge current capability with 1000pF lumped capacitive load on DOUT defined as the maximum output current during a 15V step. Note 3: Comparator threshold inputs (CVH, CVL) can be overlapped (i.e. VCVH < VCVL), but comparator output logic will be inverted and functionality of the comparators is not guaranteed under this condition.
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E7802
TEST AND MEASUREMENT PRODUCTS DC Characteristics (continued)
Parameter Power Supply Current (Quiescent) Positive Supply Current Driver Negative Supply Current Negative Supply Current Digital Supply Current ICC IDEE IEE IDD 11 1.5 11 2 24 7 16 6 40 12 26 14 mA mA mA mA Symbol Min Typ Max Units
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E7802
TEST AND MEASUREMENT PRODUCTS AC Characteristics
Parameter Driver (Note 1) Propagation Delay DATA to DOUT (Figure 5) EN to DOUT (Active to HiZ) (Figure 7) EN to DOUT (HiZ to Active) (Figure 7) Propagation Delay Matching Propagation Delay Tempco (Tj = 25 to 100 C C) Driver Propagation Delay Dispersion vs. Amplitude (VL = 0, 0.2 < VH < 3.0) Short Circuit Protection Activation Time Pulse Width for Trigger (VH=3V, VL=0V, DOUT Shorted to 0V) Short to Comparator Trigger Short to INT* Trigger Rise/Fall Times (1000pF lumped capacitance at DOUT, Figure 5a) 3V Programmed Swing (10% - 90%) 5V Programmed Swing (10% - 90%) Rise/Fall Times (100pF Lumped Capacitance at DOUT, Figure 5a) 0.4V Programmed Swing (20% - 80%) (Note 8) 1V Programmed Swing (20% - 80%) 3V Programmed Swing (10% - 90%) 5V Programmed Swing (10% - 90%) Rise/Fall Times (50 termination, Figure 5b) 0.4V Programmed Swing (20% - 80%) (Note 8) 1V Programmed Swing (20% - 80%) 3V Programmed Swing (10% - 90%) 5V Programmed Swing (10% - 90%) Maximum Operating Frequency (50 termination, Figure 5b) 0.4V Programmed Swing (Note 8) 1V Programmed Swing 3V Programmed Swing 5V Programmed Swing Maximum Operating Frequency (1K termination, Figure 5c) 0.4V Programmed Swing (Note 8) 1V Programmed Swing 3V Programmed Swing 5V Programmed Swing 15V Programmed Swing DOUT Capacitance Driver Overshoot/Preshoot/Undershoot (3V) (1K termination, Figures 5c, 13, Note 6) Minimum Pulse Width (Figures 5b, 9) 0.4V Programmed Swing (Note 8) 1V Programmed Swing 3V Programmed Swing 5V Programmed Swing Symbol Min Typ Max Units
Tpd Tz Toe |Tpd+ - Tpd-| Tpd/T Tpd(swing) Tprotect Tpd TINT* Tr/Tf Tr/Tf Tr/Tf Tr/Tf Tr/Tf Tr/Tf Tr/Tf Tr/Tf Tr/Tf Tr/Tf Fmax
13.6 8 8
15.6 17 14 1 30 1
ns ns ns ns ps/ C ns ns ns ns ns ns ns ns ns ns ns ns ns ns MHz MHz MHz MHz MHz MHz MHz MHz MHz
125 600 600 9.5 10 2 3 3.5 4 2 3 3.5 4 50 50 50 50 16 16 4 5 5.5 6.5 4 5 5.5 6.5
Fmax 50 50 50 50 50 CDOUT Vovershoot Mpw 7 7.5 8 9 ns ns ns ns 50 100
pF mV
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08
7
www.semtech.com
E7802
TEST AND MEASUREMENT PRODUCTS AC Characteristics (continued)
Parameter Comparator (Note 2) Comparator Propagation Delay (Figure 10, Note 5) Propagation Delay Matching (Note 5) Propagation Delay Tempco (Tj = 25 to 100 C C) Propagation Delay Dispersion vs. Overdrive (Note 7) (Figure 11) 100mV to 1V Overdrive 1V to 2.5V Overdrive Propagation Delay Dispersion vs. Common Mode (Figure 12, Notes 3, 7) Comparator Bandwidth (Note 4) Minimum Pulse Width VINP Capacitance CVINP 3 Tpd(cm) Fmax 100 5 Tpd +/|(Tpd+) - (Tpd-)| Tpd/T Tpd/(VINPVCH(L)) 2.5 0.25 3.5 0.5 0.5 ns ns ns MHz ns pF 3.5 5 0.5 15 6.5 1.5 20 ns ns ps/ C Symbol Min Typ Max Units
Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: Note 7: Note 8:
Driver AC specifications are with Tj = 65 C 3 C, VCC = 15V, VDD = 3.3V, DVEE = 0V, VEE = -5V, VL = 0,o = 3.0, into 20 inches of 50 transmission line unless otherwise noted. VH o Tj = 65 C 3 C, CVH = 1.5, CVL = 1.5, VINP 0 - 3V @ 10MHz. VCC = 15V, VDD = 3.3V, DVEE = 0V, VEE = -5V unless otherwise noted. VVINP = 5V pp, 0.5V < VCVH/L < .5V. Comparator bandwidth is the maximum frequency under which the comparator will switch with CVH/CVL = 1.5V, VINP = 0 to 3V. VVINP = 5Vpp, VCVH,L = 2.5V. Measured with 33pF at end of transmission line. See "Optimizing Driver Waveforms" Section for characteristics with different capacitive loads. CVH, CVL are Calibrated Threshold Values (i.e., "Switching Point"). VCC = 9V, DVEE = 0V, VEE = -5V.
45.3 Measurement Point (VX)
953
o
o
Test Circuits:
DOUT 18nH Oscilloscope
5 0
Measurement Point (VX) 20" T-line
5 0
DOUT VINP CLOAD
VINP
Oscilloscope
5 0
Figure 5a. Driver Output/Comparator Input, Lumped Load
Figure 5b. Driver Output/Comparator Input, 50 Load
45.3 DOUT 18nH VINP
5 0
Measurement Point (VX) 20" T-line
953
Oscilloscope
5 0
Figure 5c. Driver Output/Comparator Input, 1K Load
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08
8
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E7802
TEST AND MEASUREMENT PRODUCTS AC Characteristics (continued)
DOUT
Tpd+
50%
Tpd-
DATA
Figure 6. Driver Propagation Delay Measurements
DOUT
+0.5V 90%
10% 0.0V Toe T z
Time
E N
Transmission line terminated 50 to ground.
Figure 7. Driver HiZ Enable/Disable Delay Measurement Definition
Measurement Point (VX)
OUT(H) = 0.4V, 1V, 3V, 5V
OUT(H)
1 / Fmax
0.90 OUT(H)
0.0V
Time
Figure 8. Driver Fmax Measurement Definition
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08 www.semtech.com
E7802
TEST AND MEASUREMENT PRODUCTS AC Characteristics (continued)
VX High = 0.4V, 1V, 3V, 5V VX Low = 0V Period = 100ns
Measurement Point (VX)
Tpw+ VX High VX Low + 0.9 * ( X High - VXLow) V
Tpw-
Output Signal
VX Low + 0.1 * ( X High - VX Low) V VX Low
( X High + V VX Low)/2
Time
Figure 9. Driver Minimum Pulse Width Measurement Definition
VINP
100% 50% 0 %
Comparator Output
SR = 1V/ns VCVH, VCVL
Tpd+
Tpd-
Q L 50% Q H 50%
TpdTpd+
Time Time
Figure 10. Comparator Propagation Delay Measurements
INPUT: Freq = 10 MHz; 50% Duty Cycle, SR = 1V/ns
VINP
20-80% Tr/Tf for 500mV p-p = 0.3ns; for 5V p-p = 3ns
2.5V
100mV CVH/L
2.5V
2.5V
100mV
0.0V
Time
Comparator Output
Q H 50%
Tpd-
Tpd+
Time
Q L 50% Tpd+ Tpd-
Time
Figure 11. Comparator Dispersion: Overdrive Measurement Definition
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08 20 www.semtech.com
E7802
TEST AND MEASUREMENT PRODUCTS AC Characteristics (continued)
INPUT: Freq = 10 MHz VVINP
+1.5V
VCVH/L = 50%
+1.0V
VCVH/L = 50%
0.5V
VCVH/L = 50%
Comparator Output QH
Tpd+
Tpd-
50%
QL
Time
Figure 12. Comparator Dispersion: Common Mode Definition
Figure 13. Driver Overshoot, Undershoot, and Ringback
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08
2
www.semtech.com
E7802
TEST AND MEASUREMENT PRODUCTS Ordering Information
Model Number E7802ALPT E7802ALPT-T EVM7802ALPT
Package 32-pad, 5mm x 5mm QFN 32-pad, 5mm x 5mm QFN (Tape & Reel) E7802 Evaluation Board
Pb This product is lead-free.
Contact Information
Semtech Corporation Test and Measurement Division 10021 Willow Creek Rd., San Diego, CA 92131 Phone: (858)695-1808 FAX (858)695-2633
(c) 2008 Semtech Corp. , Rev. 5, 3/7/08 22 www.semtech.com

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